More information about who I am and how I operate.
Electronic Packaging Design
As can be seen in my
I have been doing electronic packaging design, and performing thermal & structural
analysis on my own design work, for over 35 years. Before attaining my B.S.M.E.
I spent 4+ years in the U.S.A.F.
as a mainframe computer technician, and understand a wide range of the details of
digital and power electronics. This helps me to understand many of the synergies
not only between thermal and structural concerns, but also the EMI, signal integrity and
other concerns in the electrical design arena.
After over 20 years as an advanced PTC Pro/e (Wildfire, Creo Parametric..) user,
I made the switch to SolidWorks in 2014. By leveraging my 20+ years of Pro/E experience
with some focused study,
my level of expertise with SolidWorks is such that I can model pretty much any desired
geometry or assembly construct, with my drawings being accurate and communicating design intent.
When it was time to have my own CAD seat in 2016, I purchased SolidWorks Premium with the Simulation
Professional FEA add-on.
I have leveraged my FEA skills from ANSYS and Pro/Mechanica, again with some focused study,
into a good journeyman skill level with SolidWorks Simulation. I am confident that my analytical
results reflect the physics of the problem at hand, with an accuracy suitable to support
design, development and testing, and predict or verify risk areas and areas of interest for
instrumentation during testing. If you are looking for promises of "art to part" this is
not the place; if you want an honest assessment of risk and indicators of areas of concern, that is
what I have found FEA to be most suited to.
If you would like me to team with you on a project, please use LinkedIn
Scott's LinkedIn Page
to contact me regarding next steps. I can work 1099 or corp-to-corp, and am flexible wrt
your requirements in that area. Billing terms and frequency are driven by project scope,
and are open to discussion.